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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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전자부품의 접합재료로서의 Sn 도금막 형성 조건 및 도금막의 특성에 관한 연구

신영의, 임민빈, 김경섭, 중전주차

A study on Plating Conditions and Characteristics of Sn layers as Inserted Metals for Electronic Component .

Young Eui Shin, Min Bin Yim, Kyung Seob Kim, Shuji Nakata
J Electr Electron Mater 1993;6(6):505-513.
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A study on Plating Conditions and Characteristics of Sn layers as Inserted Metals for Electronic Component .
J Electr Electron Mater. 1993;6(6):505-513.
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Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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A study on Plating Conditions and Characteristics of Sn layers as Inserted Metals for Electronic Component .
J Electr Electron Mater. 1993;6(6):505-513.
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