Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

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연마불균일도에 영향을 미치는 패드 표면특성에 관한 연구

박기현, 박범영, 김형재, 정해도

Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

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J Electr Electron Mater 2006;19(4):309-313.
Published online: April 1, 2006

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Keywords: Surface roughenss (R(pk); Reduced peak height) , Pad stiffness, Groove, Pad wear, Within wafer non-uniformity, WIWNU

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Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

J Electr Electron Mater. 2006;19(4):309-313. Published online April 1, 2006

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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RIS — For EndNote, ProCite, RefWorks, and most other reference management software
bib — For JabRef, BibDesk, and other BibTeX-specific software

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Citation for the content below
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Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

J Electr Electron Mater. 2006;19(4):309-313. Published online April 1, 2006

Articles

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연마불균일도에 영향을 미치는 패드 표면특성에 관한 연구

Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

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