Polishing Pad Analysis and Improvement to Control Performance

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연마성능 제어를 위한 연마패드표면 해석과 개선

박재홍, 키노시타마사하루, 요시다코이치, 박기현, 정해도

Polishing Pad Analysis and Improvement to Control Performance

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J Electr Electron Mater 2007;20(10):839-845.
Published online: October 1, 2007

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Keywords: CMP, Chemical mechanical planarization, Conditioning, Break-in, Profile, Wettability

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Polishing Pad Analysis and Improvement to Control Performance

J Electr Electron Mater. 2007;20(10):839-845. Published online October 1, 2007

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bib — For JabRef, BibDesk, and other BibTeX-specific software

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Polishing Pad Analysis and Improvement to Control Performance

J Electr Electron Mater. 2007;20(10):839-845. Published online October 1, 2007

Articles

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연마성능 제어를 위한 연마패드표면 해석과 개선

Polishing Pad Analysis and Improvement to Control Performance

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