Development of Microstructure Pad and Its Performances in STI CMP

Suk Hoon Jeong; Jae Woo Jung; Ki Hyun Park; Heon Deok Seo; Jae Hong Park; Boum Young Park; Suk Bae Joo; Jae Young Choi; Hae Do Jeong

doi:10.4313/JKEM.2008.21.3.203

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반도체 : 미세 표면 구조물을 갖는 패드의 제작 및 STI CMP 특성 연구

정석훈, 정재우, 박기현, 서헌덕, 박재홍, 박범영, 주석배, 최재영, 정해도

Development of Microstructure Pad and Its Performances in STI CMP

Suk Hoon Jeong, Jae Woo Jung, Ki Hyun Park, Heon Deok Seo, Jae Hong Park, Boum Young Park, Suk Bae Joo, Jae Young Choi, Hae Do Jeong

J Korean Inst Electr Electron Mater Eng 2008;21(3):203-207.
Published online: March 1, 2008

DOI: https://doi.org/10.4313/JKEM.2008.21.3.203

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Keywords: MS pad, microstructure pad, STI, shallow trench isolation, CMP, Pattern selectivity, Erosion, Corner rounding

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Development of Microstructure Pad and Its Performances in STI CMP

J Korean Inst Electr Electron Mater Eng. 2008;21(3):203-207. Published online March 1, 2008

DOI: https://doi.org/10.4313/JKEM.2008.21.3.203

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Development of Microstructure Pad and Its Performances in STI CMP

J Korean Inst Electr Electron Mater Eng. 2008;21(3):203-207. Published online March 1, 2008

DOI: https://doi.org/10.4313/JKEM.2008.21.3.203

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반도체 : 미세 표면 구조물을 갖는 패드의 제작 및 STI CMP 특성 연구

Development of Microstructure Pad and Its Performances in STI CMP

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