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단일 패키지의 특성 분석을 통한 고출력 발광 다이오드 모듈의 접합 온도 측정

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Regular Paper : Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package

Se Il Lee, Woo Young Kim, Young Gi Jeong, Jong Kyung Yang, Dae Hee Park
J Korean Inst Electr Electron Mater Eng 2010;23(12):973-977.
Published online: December 1, 2010
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Regular Paper : Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package
J Korean Inst Electr Electron Mater Eng. 2010;23(12):973-977.   Published online December 1, 2010
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Regular Paper : Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package
J Korean Inst Electr Electron Mater Eng. 2010;23(12):973-977.   Published online December 1, 2010
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