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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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에너지재료 : 기판 부근의 자기장이 RF 스퍼터링법으로 증착된 ITO 박막의 특성에 미치는 영향

김현수, 장호원, 강종윤, 김진상, 윤석진, 김창교

Energy Materials : Influence of Magnetic Field Near the Substrate on Characteristics of ITO Film Deposited by RF Sputtering Method

Hyun Soo Kim, Ho Won Jang, Jong Yoon Kang, Jin Sang Kim, Suk Jin Yoon, Chang Kyo Kim
J Electr Electron Mater 2012;25(7):563-568.
Published online: July 1, 2012
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Indium tin oxide (ITO) films were prepared using radio frequency (RF) magnetron sputtering method. magnets were equipped near the target in the sputter to bring the plasma near the target. The effect of magnetic field that brings the plasma near the substrate was compared with that of substrate heating. The effect of substrate heating on the grain size of the ITO thin film was larger than that of the magnetic field. However, the grain size of the ITO thin film was larger when the magnetic field was applied near the substrate during the sputtering process than when the substrate was not heated and the magnetic field was not applied. If stronger magnetic field is applied near the substrate during sputtering, it can be expected that the ITO thin film with good electrical conductivity and high transparency is obtained at low substrate temperature. When magnetic field of 90 Gauss was applied near the substrate during sputtering, the mobility of the ITO thin film increased from 15.2 ㎠/V.s to 23.3 ㎠/V.s, whereas the sheet resistivity decreased from 7.68 Ω·㎝ to 5.11 Ω·㎝.

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Energy Materials : Influence of Magnetic Field Near the Substrate on Characteristics of ITO Film Deposited by RF Sputtering Method
J Electr Electron Mater. 2012;25(7):563-568.   Published online July 1, 2012
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Energy Materials : Influence of Magnetic Field Near the Substrate on Characteristics of ITO Film Deposited by RF Sputtering Method
J Electr Electron Mater. 2012;25(7):563-568.   Published online July 1, 2012
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