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고온열전모듈용 금속유리계 페이스트 연구

서승호, 손근식, 서강현, 최순목

Research for Solder Paste in Metallic Glass System for Thermoelectric Modules

Seung-ho Seo, Geun Sik Son, Kang Hyun Seo, Soon-mok Choia
J Electr Electron Mater 2018;31(4):249-254.
Published online: May 1, 2018
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We researched about a bulk metallic glass system as an additive to an Ag paste for high temperature thermoelectric modules. Bulk metallic glass (BMG) ribbons were produced by using a rapid solidification process (RSP) under a cooling rate condition higher than 10℃/sec. We investigated BMG characteristics of the ribbons by means of x-ray diffraction (XRD) and differential scanning calorimetry (DSC) in order to evaluate the glass transition temperature (Tg) and the recrystallization temperature (Tx) lower than 400℃. A milling process was also developed to apply the BMG ribbons to a commercial Al paste as an additive for lower sintering temperature.

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Research for Solder Paste in Metallic Glass System for Thermoelectric Modules
J Electr Electron Mater. 2018;31(4):249-254.   Published online May 1, 2018
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Research for Solder Paste in Metallic Glass System for Thermoelectric Modules
J Electr Electron Mater. 2018;31(4):249-254.   Published online May 1, 2018
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