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Review of the Silicon Oxide and Polysilicon Layer as the Passivated Contacts for TOPCon Solar Cells

Mengmeng Chu, Muhammad Quddamah Khokhar, Hasnain Yousuf, Xinyi Fan, Seungyong Han, Youngkuk Kim, Suresh Kumar Dhungel, Junsin Yi
J Electr Electron Mater 2023;36(3):233-240.
Published online: May 1, 2023
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p-type Tunnel Oxide Passivating Contacts (TOPCon) solar cell is fabricated with a poly-Si/SiOx structure. It simultaneously achieves surface passivation and enhances the carriers’ selective collection, which is a promising technology for conventional solar cells. The quality of passivation is depended on the quality of the tunnel oxide layer at the interface with the c-Si wafer, which is affected by the bond of SiO formed during the subsequent annealing process. The highest cell efficiency reported to date for the laboratory scale has increased to 26.1%, fabricated by the Institute for Solar Energy Research. The cells used a p-type float zone silicon with an interdigitated back contact (IBC) structure that fabricates poly-Si and SiOx layer achieves the highest implied open-circuit voltage (iVoc) is 750 mV, and the highest level of edge passivation is 40%. This review presents an overview of p-type TOPCon technologies, including the ultra-thin silicon oxide layer (SiOx) and poly-silicon layer (poly-Si), as well as the advancement of the SiOx and poly-Si layers. Subsequently, the limitations of improving efficiency are discussed in detail. Consequently, it is expected to provide a basis for the simplification of industrial mass production.

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Review of the Silicon Oxide and Polysilicon Layer as the Passivated Contacts for TOPCon Solar Cells
J Electr Electron Mater. 2023;36(3):233-240.   Published online May 1, 2023
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Review of the Silicon Oxide and Polysilicon Layer as the Passivated Contacts for TOPCon Solar Cells
J Electr Electron Mater. 2023;36(3):233-240.   Published online May 1, 2023
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