Effects of CMP Retaining Ring Material on the Performance of Wafer Polishing Ki-Won Park, Eun-young Kim, Dong-Sam Park Journal of the Korean Society of Manufacturing Process Engineers.2020; 19(3): 22. CrossRef
Effects of Insert Materials of Retaining Ring on Polishing Finish in Oxide CMP Ki-Won Park, Dong-Sam Park Journal of the Korean Society of Manufacturing Process Engineers.2019; 18(8): 44. CrossRef
Finite Element Analysis on Dynamic Viscoelasticity of CMP Polishing Pad Byeongjun Pak, Dasol Lee, Seonho Jeong, Hyunjin Kim, Haedo Jeong Journal of the Korean Society for Precision Engineering.2019; 36(2): 177. CrossRef
A Rotationally Asymmetric Reluctance Machine With Improved Torque Density Cahya A. Harianto, Scott D. Sudhoff IEEE Transactions on Energy Conversion.2013; 28(1): 62. CrossRef
Harmonics Analysis of Leakage Current due to Artificial Contamination of Distribution Arresters Jae-Jun Park The Transactions of The Korean Institute of Electrical Engineers.2012; 61(9): 1306. CrossRef
Analysis of Leakage Current Waveforms for Transmission Line Porcelain Insulators due to ESDD Contamination Jae-Jun Park The Transactions of The Korean Institute of Electrical Engineers.2012; 61(10): 1461. CrossRef