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"Conductance"

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"Conductance"

Macro Model of DWFG MOSFET for Analog Application and Design of Operational Amplifier
Ji Hoon Ha, Ki Ju Baek, Dae Hwan Lee, Kee Yeol Na, Yeong Seuk Kim
J Korean Inst Electr Electron Mater Eng 2013;26(8):582-586.   Published online August 1, 2013
DOI: https://doi.org/10.4313/JKEM.2013.26.8.582
In this paper, a simple macro model of n-channel MOSFET with dual workfunction gate (DWFG) structure is proposed. The DWFG MOSFET has higher transconductance and lower drain conductance than conventional MOSFET. Thus analog circuit design using the DWFG MOSFET can improve circuit characteristics. Currently, device models of the DWFG MOSFET are insufficient, so simple series connected two MOSFET model is proposed. In addition, a two stage operational amplifier using the proposed DWFG MOSFET macro model is designed to verify the model.
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Nano Materials and Devices : The Electrical Properties of GaN Individual Nanorod Devices by Wet-etching of the Nanorod Surface and Annealing Treatment
Hyun Jin Ji, Jae Wan Choi, Gyu Tae Kim
J Korean Inst Electr Electron Mater Eng 2011;24(2):152-155.   Published online February 1, 2011
DOI: https://doi.org/10.4313/JKEM.2011.24.2.152
Even though nano-scale materials were very advantageous for various applications, there are still problems to be solved such as the stabilization of surface state and realization of low contact resistances between a semiconducting nanowire and electrodes in nano-electronics. It is well known that the effects of contacts barrier between nano-channel and metal electrodes were dominant in carrier transportation in individual nano-electronics. In this report, it was investigated the electrical properties of GaN nanorod devices after chemical etching and rapid thermal annealing for making good contacts. After KOH wet-etching of the contact area the devices showed better electrical performance compared with non-treated GaN individual devices but still didn`t have linear voltage-current characteristics. The shape of voltage-current properties of GaN devices were improved remarkably after rapid thermal annealing as showing Ohmic behaviors with further bigger conductivities. Even though chemical etching of the nanorod surfaces could cause scattering of carriers, in here it was shown that the most important and dominant factor in carrier transport of nano-electronics was realization of low contact barrier between nano-channel and metal electrodes surely.
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Simulation of Conductance Effects on Vacuum Characteristics of High Vacuum System for Semiconductor Processing
Hyung Taek Kim, Man Jae Seo
J Korean Inst Electr Electron Mater Eng 2010;23(4):287-292.   Published online April 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.4.287
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Simulated DC Charceristics of AlGaN HEMTs with Trench Shapped Source, Dracin Strucures
Kang Min Jung, Young Soo Lee, Su Jin Kim, Dong Ho Kim, Jae Moo Kim, Hong Goo Choi, Cheol Koo Hahn, Tae Geun Kim
J Korean Inst Electr Electron Mater Eng 2008;21(10):885-888.   Published online October 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.10.885

Citations

Citations to this article as recorded by  
  • Anomaly and defects characterization by I-V and current deep level transient spectroscopy of Al0.25Ga0.75N/GaN/SiC high electron-mobility transistors
    Salah Saadaoui, Mohamed Mongi Ben Salem, Malek Gassoumi, Hassen Maaref, Christophe Gaquière
    Journal of Applied Physics.2012;[Epub]     CrossRef
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Fabrication of CNT Field Effect Transistor
J Korean Inst Electr Electron Mater Eng 2007;20(5):389-393.   Published online May 1, 2007
DOI: https://doi.org/10.4313/JKEM.2007.20.5.389
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Fabrication and Properties of AIN/SiC Structures using Reactive RF Magnetron Sputtering Method
J Korean Inst Electr Electron Mater Eng 2005;18(11):977-982.   Published online November 1, 2005
DOI: https://doi.org/10.4313/JKEM.2005.18.11.977
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