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"Deposition rate"

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"Deposition rate"

Effects of Various Deposition Rates of Al2O3 Gate Insulator on the Properties of Organic Thin Film Transistor
Kyung Min Choi, Gun Woo Hyung, Young Kwan Kim, Eou Sik Cho, Sang Jik Kwon
J Korean Inst Electr Electron Mater Eng 2009;22(12):1063-1066.   Published online December 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.12.1063
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Process Characteristics of SiOx and SiOxNy Films on a Gas Barrier Layer using Facing Target Sputtering (FTS) System
Jin Woon Son, Yong Jin Park, Sun Young Sohn, Hwa Min Kim
J Korean Inst Electr Electron Mater Eng 2009;22(12):1028-1032.   Published online December 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.12.1028
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Surface Morphology and Dielectric Properties of SBN Thin Film by RF Sputtering Method
Jin Sa Kim, Chung Hyeok Kim
J Korean Inst Electr Electron Mater Eng 2009;22(8):671-676.   Published online August 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.8.671
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Characteristics of SiOx Gas Barrier Films as a Function of Process Conditions in Facing Target Sputtering (FTS) System
Kang Bae, Tae Hyun Wang, Sun Young Sohn, Hwa Min Kim, Jae Suk Hong
J Korean Inst Electr Electron Mater Eng 2009;22(7):595-601.   Published online July 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.7.595
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Efficiency Improvement of Organic Light-emitting Diodes depending on the Thickness Variation of BCP using Electron Transport Layer
Weon Jong Kim, Hyun Teak Shin, Jin Woong Hong
J Korean Inst Electr Electron Mater Eng 2009;22(4):327-332.   Published online April 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.4.327
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Electrical properties of OLEDs due to the Hole-size of Crucible Boat and Deposition Rate of Hole Transport Layer
Weon Jong Kim, Hyun Teak Shin, Jong Yeol Shin, Jin Woong Hong
J Korean Inst Electr Electron Mater Eng 2009;22(1):74-80.   Published online January 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.1.074
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Electrical Characteristics on the Variation of Thickness and Deposition Rate in Organic Layer of OLEDs
J Korean Inst Electr Electron Mater Eng 2006;19(4):362-366.   Published online April 1, 2006
DOI: https://doi.org/10.4313/JKEM.2006.19.4.362
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