The rapid advancement of large-scale language models and artificial intelligence technologies has highlighted the importance of data processing efficiency. This study outlines a measurement optimization method for high-speed pulse equipment to accurately analyze the operating dynamics of ReRAM, a core hardware component for simulating neural networks. An optimized evaluation methodology combining connection compensation and a dual-channel configuration was established to minimize measurement errors caused by parasitic resistance and capacitance during pulse measurements using the Keithley 4200A-SCS and 4225-PMU modules, and to address HRS/LRS measurement errors caused by mismatches between the measurement range and source limits. The proposed precision measurement guidelines can be applied to the evaluation of semiconductor devices that require pulse measurements, such as transistors and DRAM.

The solution-based fabrication process for resistive random-access memory (ReRAM) offers several advantages over conventional vapor deposition processes, including simplicity, cost-effectiveness, and high versatility for coating complex structures over large areas. In this study, a TiO₂-based ReRAM device was fabricated using a solution process with Pt top and P⁺⁺-Si bottom electrodes. The synthesized TiO₂ films contain a residual Cl element as revealed by X-ray photoelectron spectroscopy (XPS). Reversible volatile resistance switching was observed due to the formation of conductive Ti-O-Ti networks in the TiO₂ layer. Post-annealing led to an increase in the threshold voltage (Vth). Asymmetric Current-Voltage characteristics was observed due to the different in the work functions of the electrodes. Additionally, the influence of compliance current settings on filament formation and hysteresis behavior was systematically investigated. The results demonstrated that higher compliance currents enhanced the hysteresis width for both positive and negative voltage bias conditions.

In this study, Ge₂Sb₂Te₅ and Ge₈Sb₂Te₁₁ were used as an insulator layer to fabricate ReRAM devices. The resistance change is correlated to the appearance or disappearance of a conductivity filament at the surface of the GeSbTe layer. Changes in the electrical properties of ITO/GeSbTe/Ag devices were measured using a I-V-L measurement system. As a result, compared to the ITO/Ge₈Sb₂Te₁₁/Ag device, this ITO/Ge₂Sb₂Te₅/Ag ReRAM device exhibits highly uniform bipolar resistive switching characteristics, such as the operating voltages, and the resistance values.

The resistive memory switching characteristics of resistive random access memory (ReRAM) using the amorphous GeSe thin film have been demonstrated at Al/Ti/GeSe/n+ poly Si structure. This ReRAM indicated bipolar resistive memory switching characteristics. The generation and the recombination of chalcogen cations and anions were suitable to explain the bipolar switching operation. Space charge limited current (SCLC) model and Poole-Frenkel emission is applied to explain the formation of conductive filament in the amorphous GeSe thin film. The results showed characteristics of stable switching and excellent reliability. Through the annealing condition of 400℃, the possibility of low temperature process was established. Very low operation current level (set current: ~ μA, reset current: ~ nA) was showed the possibility of low power consumption. Particularly, n+ poly Si based GeSe ReRAM could be applied directly to thin film transistor (TFT).

Resistive random access memory (ReRAM) of metallic conduction channel mechanism is based on the electrochemical control of metal in solid electrolyte thin film. Amorphous chalcogenide materials have the solid electrolyte characteristic and optical reactivity at the same time. The optical reactivity has been used to improve the memory switching characteristics of the amorphous As2Se3-based ReRAM. This study focuses on the formation of holographic lattices patterns in the amorphous As2Se3 thin film for straight conductive channel. The optical parameters of amorphous As2Se3 thin film which is a refractive index and extinction coefficient was taken by n&k thin film analyzer. He-Cd laser (wavelength: 325 nm) was selected based on these basic optical parameters. The straighten conduction channel was formed by holographic lithography method using He-Cd laser. Ag+ ions that photo-diffused periodically by holographic lithography method will be the role of straight channel patterns. The fabricated ReRAM operated more less voltage and indicated better reliability.

In this study, we observed current-voltage characteristics of the MIM (metal-insulator-metal) structure. The WOx material was used between metal electrodes as the oxide insulator. The structure of the Al/WOx/TiN shows bipolar resistive switching and the operating direction of the resistive switching is clockwise, which means set at negative voltage and reset at positive voltage. The set process from HRS (high resistance state) to LRS (low resistance state) occurred at - 2.6 V . The reset process from LRS to HRS occurred at 2.78 V . The on/off current ratio was about 10 and resistive switching was performed for 5 cycles in the endurance characteristics. With consecutive switching cycles, the stable Vset and Vreset were observed. The electrical transport mechanism of the device was based on the migration of oxygen ions and the current-voltage curve is following (Ohm``s Law → Trap-Controlled Space Charge Limited Current → Ohm``s Law) process in the positive voltage region.

In this study, we developed the solution-processed PMMA-HfOx hybrid ReRAM devices to overcome the respective drawbacks of organic and inorganic materials. The performances of PMMA-HfOx hybrid ReRAM were compared to those of PMMA- and HfOx-based ReRAMs. Bipolar resistive switching behavior was observed from these ReRAMs. The PMMA-HfOx hybrid ReRAMs showed a larger operation voltage margin and memory window than PMMA-based and HfOx-based ReRAMs. The reliability and electrical instability of ReRAMs were remarkably improved by blending the HfOx into PMMA. An Ohmic conduction path was commonly generated in the LRS (low resistance state). In HRS (high resistance state), the PMMA-based ReRAM showed SCLC (space charge limited conduction). the PMMA-HfOx hybrid ReRAM and HfOx-based ReRAM revealed the Pool-Frenkel conduction. As aresult of flexibility test, serious defects were generated in HfOx film deposited on PI (polyimide) substrate. On the other hand, the PMMA and PMMA-HfOx films showed an excellent flexibility without defect generation.

The resistive switching characteristics of resistive random access memory (ReRAM) based onamorphous Ge0.5Se0.5 thin films have been demonstrated by using Ti/Ag nanocrystals/Ge0.5Se0.5/Ptstructure. Ag nanocrystals (Ag NCs) were spread on the amorphous Ge0.5Se0.5 thin film and they playedthe role of metal ions source. As a result, comparing the conventional Ag/Ge0.5Se0.5/Pt structure, thisTi/Ag NCs/Ge0.5Se0.5/Pt ReRAM device exhibits the highly uniform bipolar resistive switching (BRS)characteristics, such as the operating voltages, and the resistance values. At the same time, a stable DCendurance(> 100 cycles), and the excellent data retention (> 104 sec) properties were found from theTi/Ag NCs/Ge0.5Se0.5/Pt structured ReRAM device.

The bipolar resistive switching characteristics of resistive random access memory (ReRAM) based on HfO2 thin films have been demonstrated by using Ag/HfO2/Pt structured ReRAM device. MIcrowave irradiation (MWI) treatment at low temperature was employed in device fabrication with HfO2thin films as a transition layer. Compared to the as-deposited Ag/HfO2/Pt device, highly improved uniformity characteristics of resistance values and operating voltages were obtained from the MWI treatment Ag/HfO2/Pt ReRAM device. In addition, a stable DC endurance (> 100 cycles) and a high data retention (> 104 sec) were achieved.

Resistance-change Random Access Memory(ReRAM) memory, which utilizes electrochemical control of metal in thin films of solid electrolyte, shows great promise as a future solid state memory. The technology utilizes the electrochemical formation and removal of metallic pathways in thin films of solid electrolyte. Key attributes are low voltage and current operation, excellent scalability, and a simple fabrication sequence. In this work, we investigated the nature of thin films formed by photo doping of Ag+ ions into chalcogenide materials for use in solid electrolyte of Resistance-change RAM devices and switching characteristics according to field-effect.

In this study, we fabricate resistive switching random access memory (ReRAM) devices constructed with a Al/HfO2/ITO structure on glass substrates and investigate their memory characteristics. The hafnium oxide thin film used as a resistive switching layer is sputtered at room temperature in a sputtering system with a cooling unit. The Al/HfO2/ITO device exhibits bipolar resistive switching characteristics, and the ratio of the high resistance (HRS) to low resistance states (LRS) is more than 60. In addition, the resistance ratio maintains even after 10(4) seconds.