(La1-xBixSr0.3)FeO₃ ceramics exhibiting excellent magnetoresistance were synthesized via the conventional solid-state reaction method. The structural and electrical properties were investigated as a function of Bi3+ content to evaluate their potential application as temperature sensors. And the sintering temperature and time were 1,200℃ and 4 h, respectively. The structural and electrical properties were investigated as a function of Bi content. With increasing Bi substitution, a slight enhancement in both average grain size and relative sintered density was observed. In particular, the specimen with x = 0.3 exhibited an average grain size of approximately 0.82 μm. All samples demonstrated negative temperature coefficient of resistance (NTCR) behavior, and the electrical resistivity decreased with increasing Bi content. The resistivity of the (La0.4Bi0.3Sr0.3)FeO₃ composition was 4.68 mΩ-cm at 25°C. Additionally, the temperature coefficient of resistance (TCR) and the B25/75-value, which quantify the sensitivity of resistivity to temperature variations, were found to increase with Bi content. (La0.4Bi0.3Sr0.3)FeO₃ sample exhibited a TCR of 0.43%/°C and a B25/75-value of 1,096 K at room temperature. The electrical conduction mechanism of the (La1-xBixSr0.3)FeO₃ system was well described by the small polaron hopping model, wherein thermally activated charge carriers hop between localized Fe-O-Fe sites via electron-phonon interactions.
The composite specimens of (1-x)(La0.7Sr0.3)MnO₃-xBaTiO₃ (x = 0.05 ~ 0.3) were synthesized using the conventional solid-state reaction method, and the sintering temperature and time were 1,300℃ and 3 hours, respectively. As a result of observing the structural characteristics, the crystal structure of LSMO-BT solid solution was shown in which the rhombohedral LSMO phase and the tetragonal BT phase were separated and distributed, respectively. And fine grains having relatively small and uniformly distributed grains with sizes ranging from approximately 0.4 to 0.5 μm and pores within the specimens were observed. Notably, variations in the BT content did not significantly affect the grain size or porosity distribution, and a relative density of about 90% or more was shown. The resistivity, temperature coefficient of resistance (TCR), and B25/65-value of the 0.7LSMO-0.3BT specimen at room temperature showed the highest values of 1.94 Ω-cm, 0.292 %/℃, and 464 K, respectively. The resistivity behavior of the LSMO-BT composites matched well with the small polaron hopping conduction model.
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Structural Analysis of Electric Field-Induced Polarization and Strain in Ferroelectric BaTiO3 Jae Hwan Park Journal of Electrical and Electronic Materials.2026; 39(4): 374. CrossRef
The advantage of OTFT technology is that large-area circuits can be manufactured on flexible substrates using a lowcost solution process such as inkjet printing. Compared to silicon-based inorganic semiconductor processes, the process temperature is lower and the process time is shorter, so it can be widely applied to fields that do not require high electron mobility. Materials that have utility as electrode materials include carbon that can be solution-processed, transparent carbon thin films, and metallic nanoparticles, etc. are being studied. Recently, a technology has been developed to facilitate charge injection by coating the surface of the Al electrode with solution-processable titanium oxide (TiOx), which can greatly improve the performance of OTFT. In order to commercialize OTFT technology, an appropriate method is to use a complementary circuit with excellent reliability and stability. For this, insulators and channel semiconductors using organic materials must have stability in the air. In this study, carbon-doped Mo (MoC) thin films were fabricated with different graphite target power densities via unbalanced magnetron sputtering (UBM). The influence of graphite target power density on the structural, surface area, physical, and electrical properties of MoC films was investigated. MoC thin films deposited by the unbalanced magnetron sputtering method exhibited a smooth and uniform surface. However, as the graphite target power density increased, the rms surface roughness of the MoC film increased, and the hardness and elastic modulus of the MoC thin film increased. Additionally, as the graphite target power density increased, the resistivity value of the MoC film increased. In the performance of an organic thin film transistor using a MoC gate electrode, the carrier mobility, threshold voltage, and drain current on/off ratio (Ion/Ioff) showed 0.15 cm2/V·s, -5.6 V, and 7.5×104, respectively.
La0.7-xCexSr0.3MnO3 specimens were fabricated by a solid state reaction method and structural and electrical properties with variation of Ce4+ contents were measured. All specimens exhibited a polycrystalline rhombohedral crystal structure, and the (110) peaks were shifted to low angle side with increasing the amount of Ce4+ contents. As Ce4+ ions with different ion radii and charges are substituted with La3+ ions, electrical properties are thought to be affected by changes in the double exchange interaction between Mn3+-Mn4+ ions due to distortion of the unit lattice, a decrease in oxygen vacancy concentration, and an increase in lattice defects. Resistivity gradually decrease as the amount of Ce4+ added increased, and negative temperature coefficient of resistance (NTCR) properties were shown in all specimens. In the La0.5Ce0.2Sr0.3MnO3 specimens, electrical resistivity, TCR and B-value were 31.8 Ω-cm, 0.55%/℃ and 605 K, respectively.
The quench voltage of the second-generation superconducting wire is affected by the resistivity characteristics of the stabilization layer. The specific resistance of the stabilization layer can be changed by the deposition process using RF magnetron sputtering. In this paper, a thin film made of a homogeneous material (Ag) and a dissimilar material (Cu) was deposited on the stabilization layer of the second-generation superconducting wire through RF magnetron sputtering. We found that the specific resistance was reduced by increasing the thickness of the stabilization layer. The reduction in the resistivity of the stabilization layer led to a decrease in the quench voltage of the second-generation superconducting wire. We suggest that various characteristic changes of the second-generation superconducting wire can be expected through the successful change in the resistivity of the stabilization layer of the proposed deposition process.
In the case of ZnO:Al thin films, it is the best material that can replace ITO that is mainly used as a transparent electrode in electronic devices such as solar cells and flat-panel displays. In this study, ZnO:Al films were fabricated by using the RF dual magnetron sputtering method at various substrate temperatures. As the substrate temperature increased, the crystallinity of the ZnO:Al thin films was improved, and the electrical conductivity and electrical properties of the thin film improved owing to the increase in grain size. In addition, the surface roughness of the ZnO:Al thin films increased due to changes in the surface and density of the thin films. Moreover, the substrate temperature increased the density of thin films and improved their transmittance. To be applied to solar cells and other several electronic devices in the future, the hardness and adhesion properties of the thin film improve as the substrate temperature increases.
Using facing target magnetron sputtering (FTMS) with a graphite target source, carbon nitride thin films were deposited on silicon and glass substrates at different substrate temperatures to confirm the tribological, electrical, and structural properties of thin films. The substrate temperatures were room temperature, 150℃, and 300℃. The tribology and electrical properties of the carbon nitride thin films were measured as the substrate temperature increased, and a study on the relation between these results and structural properties was conducted. The results show that the increase in the substrate temperature during the fabrication of the carbon nitride thin films increased the hardness and elastic modulus values, the critical load value was increased, and the residual stress value was reduced. Moreover, the increase in the substrate temperature during thin-film deposition was attributed to the improvement in the electrical properties of carbon nitride thin film.
In this study, the volume resistivity of XLPE materials with various voltage ratings was discussed. The volume resistivity of the developed XPLE nanocomposite was measured, and the conductivity mechanism of the material was also examined. The ASTM D 257 and IEC 60093 measurement methods were used for these tests. The equipment was designed to measure up to a temperature of 200℃, and the electrode structure was designed to maintain the thickness and temperature uniformity of the sample. The conductivity of the sample decreased with temperature, and the samples reached saturation within 500s, after which the conductivity leveled off. By analyzing the current density and the electric field, we can well explain the electric conductivity behavior of our sample with the Schottky mechanism.
Various Ni-doped carbon (C：Ni) thin films were fabricated using different Ni target power densities by unbalanced magnetron sputtering (UBM). The effects of target power density on the structural, physical, surface, and electrical properties of C：Ni films were investigated. The UBM C：Ni thin films exhibited uniformly smooth surfaces. The rms surface roughness and friction coefficient values of the C：Ni films decreased with the increase in target power density. The physical properties of the films such as hardness and elastic moduli increased while their electrical properties such as resistivity decreased with the increase in the target power density. These results show that an increase of the power density leads to an increase in the proportion of Ni and nanocrystallization of the amorphous carbon film; this contributes to the changes observed in the physical and electrical characteristics.
Mo doped carbon (C:Mo) thin films were fabricated with various Mo target power densities by unbalanced magnetron sputtering (UBM). The effects of target power density on the surface, structural, and electrical properties of C:Mo films were investigated. UBM sputtered C:Mo thin films exhibited smooth and uniform surfaces. However, the rms surface roughness of C:Mo films were increased with the increase of target power density. Also, the resistivity value of C:Mo film as electrical properties was decreased with the increase of target power density. From the performance of organic thin filml transistor using conductive C:Mo gate electrode, the carrier mobility, threshold voltage, and on/off ratio of drain current (Ion/Ioff) showed 0.16 cm2/V·s, -6.0 V, and 7.7×104, respectively.
We investigated the characterizations of carbon films fabricated by dual magnetron sputtering under various film thickness for the electrodes in TCO-less DSSC (dye-sensitized solar cells). Carbon films prepared at various conditions were exhibited smooth and uniform surfaces without defects. Also, the rms surface roughness of carbon films was decreased from 2.25 nm to 1.0 nm with the increase of film thickness. The sheet resistance as the electrical properties are improved from 11.2×10-3 to 2.28×10-3 with the increase of film thickness. In the results, the performance of TCO-less DSSC critically depended on the film thickness of working electrodes, indicating the conductivity of carbon films.
n-type silicon shows the better tolerance towards metal impurities with a higher minority carrier lifetime compared to p-type silicon substrate. Due to better lifetime stability as compared to p-type during illumination made the photovoltaic community to switch toward n-type wafers for high efficiency silicon solar cells. We fabricated the front electrode of the n-type solar cell with AgAl paste. The electrodes characteristics of the AgAl paste depend on the contact junction depth that is closely related to the firing temperature. Metal contact depth with p+ emitter, with optimized depth is important as it influence the resistance. In this study, we optimize the firing condition for the effective formation of the metal depth by varying the firing condition. The firing was carried out at temperatures below 670℃ with low contact depth and high contact resistance. It was noted that the contact resistance was reduced with the increase of firing temperature. The contact resistance of 5.99 mΩ㎠ was shown for the optimum firing temperature of 865℃. Over 900℃, contact junction is bonded to the Si through the emitter, resulting the contact resistance to shunt. we obtained photovoltaic parameter such as fill factor of 76.68%, short-circuit current of 40.2 mA/cm2, open-circuit voltage of 620 mV and convert efficiency of 19.11%.
In this study, Ni0.79(Mn2.21-χCuχ)O4 (x=0~0.25) specimens were prepared by using a conventional mixed oxide method. All specimens were sintered in air at 1,℃ for 12 h and cooled at a rate of 2℃/min to 800℃, subsequently quenching to room temperature. We investigated the structural and electrical properties of Ni 0.79(Mn2,21-χCuχ)O4 specimens with variation of CuO amount for the application of NTC thermistors. As results of X-ray diffraction patterns, all specimens showed the formation of a complete solid solution with cubic spinel phase. The relationship between ln ρ and the reciprocal of absolute temperature(1/T) for the NTC thermistors was shown linearity, which exhibited the typical NTC thermistor properties. With increasing the amount of CuO, resistivity at room temperature, B-value, and temperature coefficient resistance decreased.
In this research, the structural, physical and electrical characteristics of Ni-Fe core chosen tominimize the errors of the Hall current sensors were investigated and Hall current sensor using Ni-Fecore was fabricated. In the result, the fabricated Ni-Fe sample exhibited the maximum hardness about29.5 GPa and the low friction coefficient about 0.35, and electrical resistivity over 90 mOhm·cm. And alsoHall current sensor using the fabricated Ni-Fe core showed linear current-voltage properties for DCcurrent at 25℃ temperature.
TiC thin films were deposited on Si wafer by unbalanced magnetron sputtering (UBMS) system with two targets of graphite and titanium. During the TiC sputtering, the RF power was varied from 100 W to 175 W and the physical and electrical properties of TiC films were investigated. The hardness and rms surface roughness of TiC films were improved with increasing RF power and the maximum hardness about 24 GPa and the minimum rms surface roughness about 1.2 nm were obtained. The resistivity of TiC films was decreased with increasing RF power. Consequently, the physical and electrical properties of TiC film wewe improved with increasing RF power.
(Ga203)x(ZnO)100-x, (GZO) films were prepared at room temperature by using a facing target sputtering (FTS) system and their electrical resistivites was investigated as a function of the Ga203 content. The GZO film with an atomic ratio of Ga203 of x 7 wt. %, shows the lowest resistivity of 7.5 X 10-4 cm. The GZO films were also prepared at various substrate temperatures from room temperature to 300t, and their electrical resistivity was found to be improved as the substrate temperature was increased, A very low resistivity of 2.8x 10u1 n that is almost comparable with that of ITO film was obtained in the GZO films prepared at the substrate temperature of 300t by using the FTS.
The alumina substrates that Ni electrode was printed on and the multi-layered PTCR thermistors of which composition is (Ba_0.998Ce_0.002)TiO_3 + 0.001MnCO_3 + 0.05BN were fabricated by a thick film process, and the effect of re-oxidation temperature on their resistivities and resistance jumps were investigated, respectively. Ni electroded alumina substrate and the multi-layered PTC thermistor were sintered at l,150℃ for 2 h under PO_2= 10^-6 Pa and then re-oxidized at 600∼850℃ for 20 min. With increasing the re-oxidation temperature, the room temperature resistivity increased and the resistance jump (LogR_290/R_25) decreased, which seems to be related to the oxidation of Ni electrode. The small sized chip PTC thermistor such as 2012 and 3216 exhibits a nonlinear and rectifying behavior in I-V curve but the large sized chip PTC thermistor such as 4532 and 6532 shows a linear and ohmic behavior. Also, the small sized chip PTC thermistor such as 2012 and 3216 is more dependent on the re-oxidation temperature and easy to. be oxidized in comparison with the large sized chip PTC thermistor such as 4532 and 6532. So, the re-oxidation conditions of chip PTC thermistor may be determined by considering the chip size.
In this paper, semiconducting shield specimens for a DC cable is fabricated and characterized by measurement of volume resistance, tensile strength, and the coefficient of expansion to show the electrical and mechanical characteristics of the semiconducting shield. Due to the PTC phenomenon, the volume resistance at 25℃ increases rapidly in comparison to the volume resistance at 90℃. Since the compounding ratio of carbon black is low, the tensile strength and density become lower and the coefficient of expansion is increased. As the general specification of the tensile strength and density is 0.8 kgf/㎟ and 150%, respectively, the fabricated specimen in this paper has excellent mechanical characteristic.
PTCR ceramics of (Ba0.998Sm0.002)TiO3 + 0.001MnCO3 + xSiO2 (x=1, 2, 3, 4, 5, 6 mol%) were fabricated by solid state method. Disk samples of diameter 5 mm and thickness about 1mm were sintered at 1,290℃ for 2 h in reduced atmosphere of 5%H2-95%N2 followed by re-oxidation at 600℃ for 30 min. in 20%O2-80%N2.and their microstructures and electrical properties were investigated with SEM and Multimeter. The color of sintered samples was strongly dependent on SiO2 content showing that the color of samples with SiO2 of 1∼2 mol% was gray but that of samples with SiO2 of 4∼6 mol% was changed from gray to blue, which seems to be related with the reduction of samples due to the oxygen vacancies created during the sintering in reduced atmosphere. SiO2 content had a great influence on the microstructure and the electrical properties. With increasing SiO2 content, the grain size of samples increased and the resistivity as well as the resistivity jump (R285/Rmin) decreased, which is considered to be attributed to the resistivity change at grain interior and grain boundary due to the fast mass transfer through SiO2 liquide phase during the sintering. Samples with 2 mol% SiO2 has the resistivity of 202 Ω cm and the resistivity jump of 3.28. It is expected that SiO2 doped BaTiO3 based PTC ceramics can be used for multilayered PTC thermistor due to the resistance to the sintering in reduced atmosphere.
This article introduces the characterization of spin coated ZnO transparent conducting oxide on the flexible substrates. As a II-IV compound semiconductor, ZnO has a wide band gap of 3.37 eV with transparent properties. Due to this transparent properties, ZnO materials can be also employed as the transparent conducting electrode materials. Therefore, strong demands have been required for the transparent electrodes with low temperature processing and cheap cost. So, We will investigate the electrical property and optical transmittance of ZnO transparent conducting oxide through the 4-point probe resistivity meter, and ultraviolet-vis spectrometer Lamda 35, respectively.
This research shows the electrical characteristic using excellent epoxy nano-composite of MgO 5.0 wt% and SiO2 0.4 wt% in mechanical strength test depending on nano-additive. First of all, volume resistance depending on nano-additive and temperature using high resistance meter (HP. 4329A) by increasing 10, 100, 1,000 V of applying voltage was measured. Moreover, temperature range of 25~120℃ with virgin sample was tested using TO-9B oven by Ando Company. The result showed that virgin and the samples added with MgO and SiO2 had similar value of volume resistance in low temperature and low electric field region and reduced with slow slope. The nano-composite`s volume resistance of sample added with MgO and SiO2 had higher value than virgin sample`s volume resistance in high temperature region more than 80℃. Moreover, the slope has steeply reduced. The volume resistance of sample added with MgO 5.0 wt% was 8.38×10(13) Ω·cm and it was 6.8 times more than virgin sample in high temperature at 120℃. The insulation characteristics were constant although filler has changed in low temperature region. But, in high temperature region, the value of volume resistance of sample with MgO 5.0 wt% was 7.6 times more than the virgin sample`s volume resistance.
ZnO is an n-type semiconductor with a wide band gap near 3.37 eV. It was known that ZnO films with a resistivity of the order of 10(-4) Ωcm is not easy to obtain. 1, 3, and 5wt% Si element were added into ZnO in ordre to improve the electrical and optical characteristics. The Si-doped ZnO (SZO) was grown on a glass substrate by radio frequency (RF) magnetron sputtering at the temperature range from 100 to 500℃. X-ray diffraction (XRD) patterns of SZO film showed preferable crystal orientation of (002) plane. It was confirmed that the lowest resistivity of the SZO films was 2.44≠10(-3) Ωcm and SZO films were significantly influenced by the working temperature. The average transmittance of the films was over 80% in the visible ranges.
ZnO with the wide band gap near 3.37 eV is typically an n-type semiconductor in which deviation from stoichiometry is electrically active. It was known that the films with a resistivity of the order of 10-4 Ωcm is not easy to obtain. In order to improve electrical characteristic of ZnO, we added 1, 3, 5 wt% Ga element in ZnO. The Ga-doped ZnO (GZO) was grown on a glass substrate by radio frequency (RF) magnetron sputtering at the temperature range from 100 to 500℃. X-ray diffraction (XRD) patterns of GZO films showed preferable crystal orientation of (002) plane. The lowest resistivity of the GZO films was 8.9×10-4 Ωcm. GZO films significantly influenced by the working temperature. The average transmittance of the films was over 80% in the visible ranges.
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Dependences of Sputtering Times on the Structural and Electrical Properties of ZnO/Ag/ZnO Thin Films on PET by DC Sputtering Yun-Hae Kim, Jin-Woo Lee, Ri-Ichi Murakami IEEE Transactions on Nanotechnology.2013; 12(6): 991. CrossRef
Review Article: Atomic layer deposition of doped ZnO films Zhengning Gao, Parag Banerjee Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films.2019;[Epub] CrossRef
Experimental Study on Fabrication of AZO Transparent Electrode for Organic Solar Cell Using Selective Low-Temperature Atomic Layer Deposition Ki-Cheol Kim, Gen-Soo Song, Hyung-Tae Kim, Kyung-Hoon Yoo, Jeong-Jin Kang, Jun-Young Hwang, Sang-Ho Lee, Kyung-Tae Kang, Heui-Seok Kang, Young-June Cho Transactions of the Korean Society of Mechanical Engineers B.2013; 37(6): 577. CrossRef
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