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Thin wafer
WHERE t1.sid in(parameter_dbtbl_keyword '%Thin wafer%') and t1.xml_status <> 99
5
results for
"Thin wafer"
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Keywords
WIWNU (3)
CMP (2)
Groove (2)
Thin wafer (2)
Within wafer non-uniformity (2)
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Publication year
2010 (1)
2006 (1)
2005 (1)
2003 (2)
Authors
Byeong Gwon Ju (2)
Yong Gug Kim (2)
Jae Hyun Bae (1)
Hae Do Jeong (1)
Yu Li Kang (1)
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Keywords
WIWNU (3)
CMP (2)
Groove (2)
Thin wafer (2)
Within wafer non-uniformity (2)
Apparent contact area (1)
Chemical mechanical planarization (1)
Chemical mechanical polishing (1)
Edge effect (1)
FBAR (1)
Flexible microsystems (1)
Material removal rate (1)
MRR (1)
Package (1)
Pad stiffness (1)
Pad thickness (1)
Pad wear (1)
RF-MEMS (1)
Stiffness (1)
Surface roughenss (R(pk); Reduced peak height) (1)
Vertical feed-through (1)
Viscoelasticity (1)
Within wafer non-uniformiy (1)
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authors
Byeong Gwon Ju (2)
Yong Gug Kim (2)
Jae Hyun Bae (1)
Hae Do Jeong (1)
Yu Li Kang (1)
Su Won Kim (1)
Jae Gyeong Kim (1)
Masaharu Kinoshita (1)
Hyun Seop Lee (1)
Hideaki Nishizawa (1)
Yun Gwon Park (1)
Jae Hong Park (1)
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2005 (1)
2003 (2)
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"Thin wafer"
Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP
Jae Hyun Bae, Hyun Seop Lee, Jae Hong Park, Hideaki Nishizawa, Masaharu Kinoshita, Hae Do Jeong
J Electr Electron Mater
2010;23(5):358-363.
Published online May 1, 2010
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Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP
J Electr Electron Mater
2006;19(4):309-313.
Published online April 1, 2006
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6
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0
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A Study on the Within Wafer Non-uniformity of Oxide Film in CMP
J Electr Electron Mater
2005;18(6):521-526.
Published online June 1, 2005
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7
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0
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Design and Fabrication of Film Bulk Acoustic Resonator for Flexible Microsystems
Yu Li Kang, Yong Gug Kim, Su Won Kim, Byeong Gwon Ju
J Electr Electron Mater
2003;16(12s):1224-1231.
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8
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Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through
Yong Gug Kim, Yun Gwon Park, Jae Gyeong Kim, Byeong Gwon Ju
J Electr Electron Mater
2003;16(12s):1237-1241.
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