Journal of Electrical and Electronic Materials

Effect of PVA Brush Contamination on Post-CMP Cleaning Performance: Han Chul Cho, Min Jong Yuh, Suk Joo Kim, Hae Do Jeong; J Korean Inst Electr Electron Mater Eng 2009;22(2):114-118. Published online February 1, 2009; DOI: https://doi.org/10.4313/JKEM.2009.22.2.114

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Particle removal behavior of micropatterned pad buffing in post-CMP cleaning
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The Characteristic Variation of Mask with Plasma Treatment: Jwa Yeon Kim, Sang Su Choi, Byung Sun Kang, Dong Soo Min, Young Jin An; J Korean Inst Electr Electron Mater Eng 2008;21(2):111-117. Published online February 1, 2008; DOI: https://doi.org/10.4313/JKEM.2008.21.2.111

Stability and Improvement of Polishing Pad in W CMP: J Korean Inst Electr Electron Mater Eng 2007;20(12):1027-1033. Published online December 1, 2007; DOI: https://doi.org/10.4313/JKEM.2007.20.12.1027

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A Study on the Polishing Characteristics Using Floating Nozzle in Linear Roll CMP
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