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Cu 배선의 평탄화를 위한 ECMD에 관한 연구

정석훈, 서헌덕, 박범영, 박재홍, 박성민, 정문기, 정해도, 김형재

Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect

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J Korean Inst Electr Electron Mater Eng 2005;18(9):793-797.
Published online: September 1, 2005
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Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect
J Korean Inst Electr Electron Mater Eng. 2005;18(9):793-797.   Published online September 1, 2005
DOI: https://doi.org/10.4313/JKEM.2005.18.9.793
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect
J Korean Inst Electr Electron Mater Eng. 2005;18(9):793-797.   Published online September 1, 2005
DOI: https://doi.org/10.4313/JKEM.2005.18.9.793
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