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경사진 전극링을 이용한 고균일도의 미세 솔더범프 형성

주철원, 이경호, 민병규, 김성일, 이종민, 강영일

Formation of Fine Pitch Solder Bump with High Uniformity by the Tilted Electrode Ring

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J Electr Electron Mater 2005;18(9):798-802.
Published online: September 1, 2005
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Formation of Fine Pitch Solder Bump with High Uniformity by the Tilted Electrode Ring
J Electr Electron Mater. 2005;18(9):798-802.   Published online September 1, 2005
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Formation of Fine Pitch Solder Bump with High Uniformity by the Tilted Electrode Ring
J Electr Electron Mater. 2005;18(9):798-802.   Published online September 1, 2005
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