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Ruthenium CMP에서 Cerium Ammonium Nitrate와 알루미나 연마 입자가 연마 거동에 미치는 영향

이상호, 이승호, 강영재, 김인권, 박진구

Effect of Cerium Ammonium Nitrate and Alumina Abrasive Particles on Polishing Behavior in Ruthenium Chemical Mechanical Planarization

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J Electr Electron Mater 2005;18(9):803-809.
Published online: September 1, 2005
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Effect of Cerium Ammonium Nitrate and Alumina Abrasive Particles on Polishing Behavior in Ruthenium Chemical Mechanical Planarization
J Electr Electron Mater. 2005;18(9):803-809.   Published online September 1, 2005
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Effect of Cerium Ammonium Nitrate and Alumina Abrasive Particles on Polishing Behavior in Ruthenium Chemical Mechanical Planarization
J Electr Electron Mater. 2005;18(9):803-809.   Published online September 1, 2005
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