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Volume 18(5); May 2005

A Study on The Improvement of Profile Tilting or Bottom Distortion in HARC: J Korean Inst Electr Electron Mater Eng 2005;18(5):389-395. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.389

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Measurement of Vacuum Pressure by Electron Emission from Carbon Nanotube Emitters: J Korean Inst Electr Electron Mater Eng 2005;18(5):396-400. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.396

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Electrical Characteristics of the Dual Gate Emitter Switched Thyristor: J Korean Inst Electr Electron Mater Eng 2005;18(5):401-406. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.401

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The Relation Among the Linear Energy Transfer and Changes of Polyphenylene Sulfide Surface by Lon Implantation: J Korean Inst Electr Electron Mater Eng 2005;18(5):407-413. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.407

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Atomic Scale Modeling of Chemical Mechanical Polishing Process: J Korean Inst Electr Electron Mater Eng 2005;18(5):414-422. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.414

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Single-silicon TFT Structure for Kink-effect Suppression with Symmetric Dual-gate by Three Split Floating N+ Zones: J Korean Inst Electr Electron Mater Eng 2005;18(5):423-430. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.423

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Design and Fabrication of the Built-in Testing Circuit for Improving IC Reliability: J Korean Inst Electr Electron Mater Eng 2005;18(5):431-438. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.431

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A Burn-in Test System with Dynamic Bone Allocation
Sam-Kweon Oh, Joong-Han Shin
Journal of the Korea Academia-Industrial cooperation Society.2009; 10(1): 75. CrossRef

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Effect of ZrO2 Buffer Layers for Pt/Bi(3.25)La(0.75)Ti3O12/ZrO2/Si (MFIS)-FET Structures: J Korean Inst Electr Electron Mater Eng 2005;18(5):439-444. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.439

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Aging Phenomena of Multilayered PMN-PZT Ceramic Actuator: J Korean Inst Electr Electron Mater Eng 2005;18(5):445-449. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.445

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Adhesion and Electrical Performance by Plasma Treatment of Semiconductive Silicone Rubber: J Korean Inst Electr Electron Mater Eng 2005;18(5):450-456. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.450

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Fast Computation Algorithm for the Impedance Calculation of Irregular Shaped Metal- dielectric-metal Type Power Distribution Plane: J Korean Inst Electr Electron Mater Eng 2005;18(5):457-463. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.457

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Electric Properties of Superconducting Ceramic Thick Films: J Korean Inst Electr Electron Mater Eng 2005;18(5):464-467. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.464

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Electrical Characteristics of HTS Tube Depending on Processing Parameters: J Korean Inst Electr Electron Mater Eng 2005;18(5):468-472. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.468

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Effect of an External AC Magnetic Field on Dynamic Resistance and Loss Characteristic in a Bi-2223 Tape: J Korean Inst Electr Electron Mater Eng 2005;18(5):473-477. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.473

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Transport Loss Characteristics of the Bi-2223 Tapes in an External AC Magnetic Field
K. Ryu, H.J. Song, H.J. Kim, K.C. Seong
IEEE Transactions on Applied Superconductivity.2006; 16(2): 1011. CrossRef

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A Study on the Deposition of Permalloy Nanostructured Thin Film Utilizing Supersonic Deposition of Nanoparticles Formed by Laser Ablation of Microparticles: J Korean Inst Electr Electron Mater Eng 2005;18(5):478-483. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.478

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Some Considerations on the On-site Applicability of PSA(Pulse Sequence Analysis) as a Partial Discharge Analysis Method: J Korean Inst Electr Electron Mater Eng 2005;18(5):484-489. Published online May 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.5.484

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