In this study, we performed the deposition of Al thin film using a DC magnetron sputtering method. To evaluate electrical and structural properties, the growth conditions were changed in terms of two functions, namely, sputtering power ranging from 41.6 to 216 W and film growth rate ranging from 5.35 to 26.39 nm/min. The growth rate and the microstructure were characterized by a scanning electron microscopy and X-ray diffraction analysis. The plane of crystalline growth showed that the preferential (111) direction and defects due to the grain boundary increased with DC power. The resistivity of the Al film over 50 nm showed a constant value by horizontal grain growth. Our results can be applicable for the preparation of nano-templates for anodic aluminum oxide.

This research introduces the sputtered IZO thin film transistor (TFT) with solution-processed Al₂O₃ diffusion layer. IZO is one of the most commonly used amorphous oxide semiconductor (AOS) TFT. However, most AOS TFTs have many defects that degrade performance. Especially oxygen vacancy in the active layer. In previous research, aluminum was used as a carrier suppressor by binding the oxygen vacancy and making a strong bond with oxygen atoms. In this paper, we use a solution-processed Al₂O₃ diffusion layer to fabricate stable IZO TFTs. A double-layer solution-processed Al2O3-sputtered IZO TFT showed better performance and stability, compared to normal sputtered IZO TFT.

Anodic aluminum oxides (AAO) fabricated by the two-step anodizing process have attracted much attention for the fabrication of nano template because of pore structure with high aspect ratio, low cost process and ease of fabrication. AAOs are characterized by a homogeneous morphology of parallelpores that grow perpendicular to the template surface with a narrow distribution of diameter, length and inter-pores spacing, all of which can be easily controlled by suitably choosing of the anodizingparameters such as pH of the electrolyte, anodizing voltage and duration of anodizing. In this study, AAOtemplates were characterized by X-ray diffraction and field-emission scanning electron microscope(FE-SEM). The dependence of the pore size change according to the amount of addition of phosphoric acid, which was used to remove the initial alumina oxide layer, was not observed.

In this study, we fabricated anodic aluminum oxide (AAO) membrane by two step anodizing process for pH detection. The structural properties were observed by X-ray diffraction (XRD) and field emission scanning electron microscope (FE-SEM). Electrochemical measurements of the pH sensor have been performed in capacitance-voltage (C-V) and drift rates. The characterization of AAO membrane exhibited high sensitivity (99.1 mV/pH) at second anodizing time of 4 min.이 논문에 참고문헌이 0건 있습니다.

Aluminum oxide(Al2O3) film deposited by atomic layer deposition (ALD) is known to supply excellent surface passivation properties on crystalline Si surfaces. Since Al2O3 has fixed negative charge, it forms effective surface passivation by field effect passivation on the rear side in p-type silicon solar cell. However, Al2O3 layer formed by ALD process needs very long process time, which is not applicable in mass production of silicon solar cells. In this paper, plasma-assisted ALD(PA-ALD) was applied to form Al2O3 to reduce the process time. Al2O3 synthesized by ALD on c-Si (100) wafers contains a very thin interfacial SiO2 layer, which was confirmed by FTIR and TEM. To improve passivation quality of Al2O3layer, the deposition temperature was changed in range of 150∼350℃, then the annealing temperature and time were varied. As a result, the silicon wafer with aluminum oxide film formed in 250℃, 400℃ and 10min for the deposition temperature, the annealing temperature and time, respectively, showed the best lifetime of 1.6ms. We also observed blistering with nanometer size during firing of Al2O3 deposited on p-type silicon.