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"Aluminum oxide"

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"Aluminum oxide"

The Study of Electrical and Structural Performance of Aluminum Thin Film Deposited by Sputtering Method
Doyoung Kim
J Korean Inst Electr Electron Mater Eng 2020;33(2):114-117.   Published online March 1, 2020
DOI: https://doi.org/10.4313/JKEM.2021.33.2.7
In this study, we performed the deposition of Al thin film using a DC magnetron sputtering method. To evaluate electrical and structural properties, the growth conditions were changed in terms of two functions, namely, sputtering power ranging from 41.6 to 216 W and film growth rate ranging from 5.35 to 26.39 nm/min. The growth rate and the microstructure were characterized by a scanning electron microscopy and X-ray diffraction analysis. The plane of crystalline growth showed that the preferential (111) direction and defects due to the grain boundary increased with DC power. The resistivity of the Al film over 50 nm showed a constant value by horizontal grain growth. Our results can be applicable for the preparation of nano-templates for anodic aluminum oxide.
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Improved Stability Sputtered IZO Thin Film Transistor Using Solution Processed Al2O3 Diffusion Layer
Namgyung Hwang, Yooseong Lim, Jeong Seok Lee, Sehyeong Lee, Moonsuk Yi
J Korean Inst Electr Electron Mater Eng 2018;31(5):273-277.   Published online July 1, 2018
DOI: https://doi.org/10.4313/JKEM.2018.31.5.273
This research introduces the sputtered IZO thin film transistor (TFT) with solution-processed Al2O3 diffusion layer. IZO is one of the most commonly used amorphous oxide semiconductor (AOS) TFT. However, most AOS TFTs have many defects that degrade performance. Especially oxygen vacancy in the active layer. In previous research, aluminum was used as a carrier suppressor by binding the oxygen vacancy and making a strong bond with oxygen atoms. In this paper, we use a solution-processed Al2O3 diffusion layer to fabricate stable IZO TFTs. A double-layer solution-processed Al2O3-sputtered IZO TFT showed better performance and stability, compared to normal sputtered IZO TFT.
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Thin Films and Sensors : Fabrication and Characterization of AAO Template with Variation of the Phosphoric Acid Amount of the Etching Solution
Ye Won Jo, Yong Jun Kim, Jin Ho Yeo, Sung Gap Lee, Young Gon Kim
J Korean Inst Electr Electron Mater Eng 2014;27(7):448-451.   Published online July 1, 2014
DOI: https://doi.org/10.4313/JKEM.2014.27.7.448
Anodic aluminum oxides (AAO) fabricated by the two-step anodizing process have attracted much attention for the fabrication of nano template because of pore structure with high aspect ratio, low cost process and ease of fabrication. AAOs are characterized by a homogeneous morphology of parallelpores that grow perpendicular to the template surface with a narrow distribution of diameter, length and inter-pores spacing, all of which can be easily controlled by suitably choosing of the anodizingparameters such as pH of the electrolyte, anodizing voltage and duration of anodizing. In this study, AAOtemplates were characterized by X-ray diffraction and field-emission scanning electron microscope(FE-SEM). The dependence of the pore size change according to the amount of addition of phosphoric acid, which was used to remove the initial alumina oxide layer, was not observed.
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Enerhy Materials : Improvement on the Passivation Effect of Al2O3 Layer Deposited by PA-ALD in Crystalline Silicon Solar Cells
Se Young Song, Min Gu Kang, Hee Eun Song, Hyo Sik Chang
J Korean Inst Electr Electron Mater Eng 2013;26(10):754-759.   Published online October 1, 2013
DOI: https://doi.org/10.4313/JKEM.2013.26.10.754
Aluminum oxide(Al2O3) film deposited by atomic layer deposition (ALD) is known to supply excellent surface passivation properties on crystalline Si surfaces. Since Al2O3 has fixed negative charge, it forms effective surface passivation by field effect passivation on the rear side in p-type silicon solar cell. However, Al2O3 layer formed by ALD process needs very long process time, which is not applicable in mass production of silicon solar cells. In this paper, plasma-assisted ALD(PA-ALD) was applied to form Al2O3 to reduce the process time. Al2O3 synthesized by ALD on c-Si (100) wafers contains a very thin interfacial SiO2 layer, which was confirmed by FTIR and TEM. To improve passivation quality of Al2O3layer, the deposition temperature was changed in range of 150∼350℃, then the annealing temperature and time were varied. As a result, the silicon wafer with aluminum oxide film formed in 250℃, 400℃ and 10min for the deposition temperature, the annealing temperature and time, respectively, showed the best lifetime of 1.6ms. We also observed blistering with nanometer size during firing of Al2O3 deposited on p-type silicon.

Citations

Citations to this article as recorded by  
  • Properties of liquid phase deposited aluminium oxide thin film on black silicon fabricated by aluminium-assisted chemical etching
    Suleman Kazim Omotayo, Nuranis Liyana Muhamad Burhan, Mohd Marzaini Mohd Rashid, Mohd Zamir Pakhuruddin
    Physica Scripta.2025; 100(3): 035545.     CrossRef
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Thin Films and Sensors : Structural and Electrical Properties of Nanotube as Various Second Anodizing Time for Biosensor
Yong Jun Kim, Tae Ho Lee, Hye Rin Jung, Sung Gap Lee
J Korean Inst Electr Electron Mater Eng 2013;26(10):741-744.   Published online October 1, 2013
DOI: https://doi.org/10.4313/JKEM.2013.26.10.741
In this study, we fabricated anodic aluminum oxide (AAO) membrane by two step anodizing process for pH detection. The structural properties were observed by X-ray diffraction (XRD) and field emission scanning electron microscope (FE-SEM). Electrochemical measurements of the pH sensor have been performed in capacitance-voltage (C-V) and drift rates. The characterization of AAO membrane exhibited high sensitivity (99.1 mV/pH) at second anodizing time of 4 min.이 논문에 참고문헌이 0건 있습니다.
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Effects of Various Deposition Rates of Al2O3 Gate Insulator on the Properties of Organic Thin Film Transistor
Kyung Min Choi, Gun Woo Hyung, Young Kwan Kim, Eou Sik Cho, Sang Jik Kwon
J Korean Inst Electr Electron Mater Eng 2009;22(12):1063-1066.   Published online December 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.12.1063
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Change in Electrical Properties of Al2O3/Gan MIS Structures according to the Thickness of Al2O3 Thin Film and Annealing Temperature
No-Won Kwak, Woo Seok Lee, Ka Lam Kim, Hyun Jun Kim, Kwang Ho Kim
J Korean Inst Electr Electron Mater Eng 2009;22(6):470-475.   Published online June 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.6.470
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Fabrication and Electrical Properties of Al2O3/GaN MIS Structures using Remote Plasma Atomic Layer Deposition
Hyeong Seon Yun, Hyun Jun Kim, Woo Seok Lee, No Won Kwak, Ka Lam Kim, Kwang Ho Kim
J Korean Inst Electr Electron Mater Eng 2009;22(4):350-354.   Published online April 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.4.350
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Fabrication and Electrical Properties of GaN MIS Structures using Aluminum Oxide Thin Film
Hyeong Seon Yun, Sang Hyun Jeong, No Won Kwak, Ka Lam Kim, Woo Seok Lee, Kwang Ho Kim, Ju Ok Seo
J Korean Inst Electr Electron Mater Eng 2008;21(4):329-334.   Published online April 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.4.329
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Fabrication and Electrical Properties of SiC MIS Structures using Aluminum Oxide Thin Film
J Korean Inst Electr Electron Mater Eng 2007;20(10):859-863.   Published online October 1, 2007
DOI: https://doi.org/10.4313/JKEM.2007.20.10.859
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