Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry

Yong Jin Seo; Chang Jun Park; Woon Shik Choi; Sang Yong Kim; Jin Sung Park; Woo Sun Lee

doi:10.4313/JKEM.2003.16.6.465

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탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성

서용진, 박창준, 최운식, 김상용, 박진성, 이우선

Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry

Yong Jin Seo, Chang Jun Park, Woon Shik Choi, Sang Yong Kim, Jin Sung Park, Woo Sun Lee

J Korean Inst Electr Electron Mater Eng 2003;16(6):465-470.
Published online: June 1, 2003

DOI: https://doi.org/10.4313/JKEM.2003.16.6.465

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Keywords: CMP, chemical mechanical polishing, Slurry, Abrasive, COC, cost of consumables, COO, cost of Ownership

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Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry

J Korean Inst Electr Electron Mater Eng. 2003;16(6):465-470. Published online June 1, 2003

DOI: https://doi.org/10.4313/JKEM.2003.16.6.465

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Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry

J Korean Inst Electr Electron Mater Eng. 2003;16(6):465-470. Published online June 1, 2003

DOI: https://doi.org/10.4313/JKEM.2003.16.6.465

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탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성

Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry

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