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Volume 18(4); April 2005

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CMP Properties of Oxide Film with Various Pad Conditioning Temperatures
J Electr Electron Mater 2005;18(4):297-302.   Published online April 1, 2005
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Electrochemical Corrosion and Chemical Mechanical Polishing(CMP) Characteristics of Tungsten Film using Mixed Oxidizer
J Electr Electron Mater 2005;18(4):303-308.   Published online April 1, 2005
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Design of 13.56 MHz RFID Tag IC
J Electr Electron Mater 2005;18(4):309-312.   Published online April 1, 2005
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A Study on the Characteristics of Stick-slip Friction in CMP
J Electr Electron Mater 2005;18(4):313-320.   Published online April 1, 2005
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Fixed Abrasive Pad with Self-conditioning in CMP Process
J Electr Electron Mater 2005;18(4):321-326.   Published online April 1, 2005
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Effect of the Hydrogen Annealing on the Pb(Zr0.52Ti0.48)O3 Film using (Pb0.72La0.28)Ti0.94O3 Buffers
J Electr Electron Mater 2005;18(4):327-329.   Published online April 1, 2005
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Effects of (100) Orientation of LaNiO3 on the Growth and Ferroelectric Properties of Pb(Zr, Ti)O3 Thin Films
J Electr Electron Mater 2005;18(4):338-343.   Published online April 1, 2005
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Electrical and Optical Characteristics of Plasma Display Panel Fabricated by Vacuum In-Line Sealing
J Electr Electron Mater 2005;18(4):344-349.   Published online April 1, 2005
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Study of Space Charge of Metal/copper(2)-phthalocyanine Interface
J Electr Electron Mater 2005;18(4):350-356.   Published online April 1, 2005
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Structure and Characteristics of Tandem Solar Cell Composed of Dye-sensitized Solar Cell and Thermoelectric Generator
J Electr Electron Mater 2005;18(4):357-362.   Published online April 1, 2005
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AC Loss Characteristic in the Fault Current Limiting Elements of a Coil Type
J Electr Electron Mater 2005;18(4):370-374.   Published online April 1, 2005
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Measurement of Ar Temperature of Hollow Cathode Discharge Plasma
Jun Hoi Lee, Jae Soo Shin, Sung Jik Lee, Min Soo Lee
J Electr Electron Mater 2005;18(4):381-385.   Published online April 1, 2005
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