For the improvement of the anti-pollution properties of porcelain electrical insulators, in this study, we have applied the functional film to the surface of insulator. The functional films were coated on the ceramic substrates which components were like the porcelain electrical insulator. The coating material was applied to ceramic substrate by spray coating method and then the film was cured at around 300oC for 10 minutes with different gas ambient, such as O2, N2, and only vacuum. We have measured the contact angle of the coated surface, and obtained the lowest angle (8.9o) and a strong hydrophilic property at vacuum condition. The anti-pollution properties were measured, revealing that as the contact angle decreased, the anti-pollution properties improved. The mechanical hardness and adhesion were both excellent regardless of the annealing ambient.

Diagnostic tests were performed on two high voltage (HV) motor stator windings. These tests included the measurement of insulation resistance, polarization index, AC current, dissipation factor (tanδ) and partial discharge (PD) magnitude. Surface contamination of HV motor stator windings has an effect on the AC current and tanδ. When the stator windings were finished cleaning and insulation reinforcement, the increase rate of AC current (ΔI) and dissipation factor (Δtanδ) were very small compared to those before cleaning. However, the PD magnitude remained the same. These tests show that cleaning and insulation reinforcement of HV motor stator windings can reduce the insulation failure.

Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.