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"Contact resistance"

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"Contact resistance"

Analysis of Electrical Characteristics Due to Deterioration of Electromagnetic Contactor
Sun-ho Choi
J Korean Inst Electr Electron Mater Eng 2019;32(5):407-412.   Published online September 1, 2019
DOI: https://doi.org/10.4313/JKEM.2019.32.5.407
In this paper, the changes in the electrical characteristics (arc energy, contact resistance, and bouncing phenomenon) due to the deterioration of the contact are analyzed. The results are generally consistent and can be analyzed for contact deterioration. The results of the experiment demonstrate that the arc energy is linearly related to the current when the contact samples and the voltage conditions are the same. The contact resistance varies due to multiple factors, but is generally within a certain range, and the contact deterioration can be determined. Contact stabilization can be detected by the decrease in the bouncing phenomenon due to deterioration (the change of the shape of the contact).
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A Study on Specific Contact Resistance Reduction of Ni Germanide/P-type Ge Using Terbium Interlayer
Geon-ho Shin, Meng Li, Jeongchan Lee, Hyeong-sub Song, So-yeong Kim, Ga-won Lee, Jungwoo Oh, Hi-deok Lee
J Korean Inst Electr Electron Mater Eng 2018;31(1):6-10.   Published online January 1, 2018
DOI: https://doi.org/10.4313/JKEM.2018.31.1.6
Ni germanide (NiGe) is a promising alloy material with small contact resistance at the source/drain (S/D) of Ge MOSFETs. However, it is necessary to reduce the specific contact resistance between NiGe and the doped Ge S/D region in high-performance MOSFETs. In this study, a novel method is proposed to reduce the specific contact resistance between NiGe and p-type Ge (p-Ge) using a Tb interlayer. The specific contact resistance between NiGe and p-Ge was successfully decreased with the introduction of the Tb interlayer. To investigate the mechanism behind the reduction in the specific contact resistance, the elemental distribution and crystalline structure of NiGe were analyzed using secondary ion mass spectroscopy and X-ray diffraction. It is likely that the reduction in specific contact resistance was caused by an increase in the concentration of boron in the space between NiGe and p-Ge due to the influence of the Tb interlayer.
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Regular Paper : Analysis of the Bounce Phenomenon According to the Load of the Relay Contact
Sun Ho Choi, Kwan Sik Kim, Jae Man Ryu, Chang Su Huh
J Korean Inst Electr Electron Mater Eng 2015;28(2):115-119.   Published online February 1, 2015
DOI: https://doi.org/10.4313/JKEM.2015.28.2.115
The power relay can be easily controlled with high voltage and current through the contacts. For this reason, has become widely used range in a variety of applications. In this study, we measured the contact resistance between the bouncing phenomenon of contact due to the change of load. The results of the experiment, the contact resistance increases with the deterioration of the contact, it is possible to predict the life of the relay contacts through the contact resistance. And relay bounce duration time have occurred in 3.5 ㎳ or less. In addition, it is possible to use the results to design an arc suppression circuit device.
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Nano Materials and Devices : The Electrical Properties of GaN Individual Nanorod Devices by Wet-etching of the Nanorod Surface and Annealing Treatment
Hyun Jin Ji, Jae Wan Choi, Gyu Tae Kim
J Korean Inst Electr Electron Mater Eng 2011;24(2):152-155.   Published online February 1, 2011
DOI: https://doi.org/10.4313/JKEM.2011.24.2.152
Even though nano-scale materials were very advantageous for various applications, there are still problems to be solved such as the stabilization of surface state and realization of low contact resistances between a semiconducting nanowire and electrodes in nano-electronics. It is well known that the effects of contacts barrier between nano-channel and metal electrodes were dominant in carrier transportation in individual nano-electronics. In this report, it was investigated the electrical properties of GaN nanorod devices after chemical etching and rapid thermal annealing for making good contacts. After KOH wet-etching of the contact area the devices showed better electrical performance compared with non-treated GaN individual devices but still didn`t have linear voltage-current characteristics. The shape of voltage-current properties of GaN devices were improved remarkably after rapid thermal annealing as showing Ohmic behaviors with further bigger conductivities. Even though chemical etching of the nanorod surfaces could cause scattering of carriers, in here it was shown that the most important and dominant factor in carrier transport of nano-electronics was realization of low contact barrier between nano-channel and metal electrodes surely.
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Characterization of Electrical Resistance for SABiT Technology-Applied PCB: Dependence of Bump Size and Fabrication Condition
Chul Ho Song, Young Hun Kim, Sang Min Lee, Jee Soo Mok, Yong Suk Yang
J Korean Inst Electr Electron Mater Eng 2010;23(4):298-302.   Published online April 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.4.298
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Simulated DC Charceristics of AlGaN HEMTs with Trench Shapped Source, Dracin Strucures
Kang Min Jung, Young Soo Lee, Su Jin Kim, Dong Ho Kim, Jae Moo Kim, Hong Goo Choi, Cheol Koo Hahn, Tae Geun Kim
J Korean Inst Electr Electron Mater Eng 2008;21(10):885-888.   Published online October 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.10.885

Citations

Citations to this article as recorded by  
  • Anomaly and defects characterization by I-V and current deep level transient spectroscopy of Al0.25Ga0.75N/GaN/SiC high electron-mobility transistors
    Salah Saadaoui, Mohamed Mongi Ben Salem, Malek Gassoumi, Hassen Maaref, Christophe Gaquière
    Journal of Applied Physics.2012;[Epub]     CrossRef
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Electrical Properties of a Single ZnO Nanowire in a Four-probe Configuration
J Korean Inst Electr Electron Mater Eng 2005;18(12):1087-1091.   Published online December 1, 2005
DOI: https://doi.org/10.4313/JKEM.2005.18.12.1087

Citations

Citations to this article as recorded by  
  • Evidence of Piezoelectric Potential and Screening Effect in Single Highly Doped ZnO:Ga and ZnO:Al Nanowires by Advanced Scanning Probe Microscopy
    Oleksandr Synhaivskyi, David Albertini, Pierre Gaffuri, Jean-Michel Chauveau, Vincent Consonni, Brice Gautier, Georges Bremond
    The Journal of Physical Chemistry C.2021; 125(28): 15373.     CrossRef
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Reduction of Operating Voltage of GaN-based Blue-violet Laser Diode by using Highly Mg Doped GaN Layer
Joon Seop Kwak
J Korean Inst Electr Electron Mater Eng 2004;17(7):764-769.   Published online July 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.7.764
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Effects of Ozone Oxidation on the Contact Resistance of DRAM Cell
Jae Seung Choe, Seung Ug Lee, Bong Jo Sin, Geun Hyeong Park, Jae Bong Lee
J Korean Inst Electr Electron Mater Eng 2004;17(2):121-126.   Published online February 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.2.121
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SIH4 Soak Effects in the W plug CVD Process
Woo Sun Lee, Yong Jin Seo, Sang Yong Kim, Jin Seung Park
J Korean Inst Electr Electron Mater Eng 2003;16(1):1-4.   Published online January 1, 2003
DOI: https://doi.org/10.4313/JKEM.2003.16.1.001
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