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"Pad"

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"Pad"

Analysis of Voltage Generating Characteristics of Composite Rail Pad Composed of Piezoelectric PVDF Film and Polyurethane Bonding Materials
Hojin Cho, Yujin Lim, Sung Su Kim, Jong Kwan Lee
J Electr Electron Mater 2017;30(6):381-386.   Published online June 1, 2017
A railway track generates severe levels of vibrations. In order to reduce these vibrations and to provide structural stability, various rail pads, mats, etc., are used for vibration protection. In this study, a specially designed rail pad was developed to reduce vibration and to generate electric power simultaneously, that is, by using the vibrations generated by railway cars on the track. The newly developed rail pads were tested to evaluate the characteristics of electric power by investigating the generated voltage and the current levels and patterns. In addition, we proposed an optimal laminated structure and adhesive by comparing the voltage generated by each type of adhesive required for optimal adhesion of the rail pad and the piezoelectric device.
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Regular Paper : Characteristic of On-resistance Improvement with Gate Pad Structure
Ye Hwan Kang, Won Young Yoo, Woo Taek Kim, Tae Su Park, Eun Sik Jung, Chang Heon Yang
J Electr Electron Mater 2015;28(4):218-221.   Published online April 1, 2015
Power MOSFETs (metal oxide semiconductor field effect transistor) operate as energy control semiconductor switches. In order to reduce energy loss of the device during switch-on state, it is essential to increase its conductance. In this study we have investigated a structure to reduce the on-resistance characteristics of the MOSFET. We have a proposed MOSFET structure of active cells region buried under the gate pad. The measurement are carried out with a EDS to analyze electrical characteristics, and the proposed MOSFET are compared with the conventional MOSFET. The result of proposed MOSFET was 1.68[Ω], showing 10% improvement compared to the conventional MOSFET at 700[V].
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Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP
Jae Hyun Bae, Hyun Seop Lee, Jae Hong Park, Hideaki Nishizawa, Masaharu Kinoshita, Hae Do Jeong
J Electr Electron Mater 2010;23(5):358-363.   Published online May 1, 2010
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A Study on Pad Profile Variation using Kinematical Analysis on Swing Arm Conditioner
Ji Heon Oh, Sang Jik Lee, Ho Jun Lee, Han Chul Cho, Hyun Seop Lee, Hyoung Jae Kim, Hae Do Jeong
J Electr Electron Mater 2008;21(11):963-967.   Published online November 1, 2008
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Development of Microstructure Pad and Its Performances in STI CMP
Suk Hoon Jeong, Jae Woo Jung, Ki Hyun Park, Heon Deok Seo, Jae Hong Park, Boum Young Park, Suk Bae Joo, Jae Young Choi, Hae Do Jeong
J Electr Electron Mater 2008;21(3):203-207.   Published online March 1, 2008
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Effect of Pad Buffing process on Material Removal Characteristics in Silicon Chemical Mechanical Polishing
J Electr Electron Mater 2007;20(4):303-307.   Published online April 1, 2007
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Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP
J Electr Electron Mater 2006;19(4):309-313.   Published online April 1, 2006
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CMP Properties of Oxide Film with Various Pad Conditioning Temperatures
J Electr Electron Mater 2005;18(4):297-302.   Published online April 1, 2005
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Fixed Abrasive Pad with Self-conditioning in CMP Process
J Electr Electron Mater 2005;18(4):321-326.   Published online April 1, 2005
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Application of Herd Porous Pad in Metal CMP Process
Sang Yong Kim, Nam Hoon Kim, In Pyo Kim, Eui Goo Chang
J Electr Electron Mater 2003;16(5):385-389.   Published online May 1, 2003
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