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"Non-uniformity"

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"Non-uniformity"

Semiconduclor : The Study on the Non-Uniformity of PECVD SiO2 Deposition by the Plasma Diagnostics
Young Hyun Ham, Kwang Ho Kwon, Hyun Woo Lee
J Electr Electron Mater 2011;24(2):89-94.   Published online February 1, 2011
The cause of the thickness non-uniformity in the large area deposition of SiO2 films by PECVD(Plasma Enhanced Chemical Vapor Deposition) was investigated by the plasma diagnostics. The spatial distribution of the plasma species in the chamber was obtained with DLP(Double Langmuir Probe) and the new-designed probe-type QMS(Quadrupole Mass Spectrometer). From the relationship between the spatial distribution of the plasma species and the depositing rate of the SiO2 films, it was conformed that the non-uniform deposition of SiO2 films was related with the spatial distribution of the oxygen radical density and electron temperature.
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Effect of Temperature on Polishing Properties in Oxide CMP
Young Jin Kim, Boum Young Park, Hyoung Jae Kim, Hae Do Jeong
J Electr Electron Mater 2008;21(2):93-98.   Published online February 1, 2008
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Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP
J Electr Electron Mater 2006;19(4):309-313.   Published online April 1, 2006
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A Study on the Within Wafer Non-uniformity of Oxide Film in CMP
J Electr Electron Mater 2005;18(6):521-526.   Published online June 1, 2005
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Planarization Characteristics of CMP for WO3 Film with an Addition of Oxidizers
J Electr Electron Mater 2005;18(1):12-16.   Published online January 1, 2005
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A Study on DOE Method to Optimize the Process Parameters for Cu CMP
J Electr Electron Mater 2005;18(1):24-29.   Published online January 1, 2005
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A Study on CMP Properties of SnO2 Thin Film for Application of Gas Sensor
J Electr Electron Mater 2004;17(12):1296-1300.   Published online December 1, 2004
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Aging Effects of Silica Slurry and Oxide CMP Characteristics
U Seon Lee, Pil Ju Go, Yeong Sig Lee, Yong Jin Seo, Gwang Jun Hong
J Electr Electron Mater 2004;17(2):138-143.   Published online February 1, 2004
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Effects of Oxidizer Additive on the Performance of Copper-Chemical Mechanical Polishing using Tungsten Slurry
U Seon Lee, Gwon U Choe, Yeong Sig Lee, Yeon Og Choe, Yong Taeg O, Yong Jin Seo
J Electr Electron Mater 2004;17(2):156-161.   Published online February 1, 2004
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Effects of Mixed Oxidizer on the W-CMP Characteristics
Chang Jun Park, Yong Jin Seo, Sang Yong Kim, U Seon Lee
J Electr Electron Mater 2003;16(12s):1181-1186.
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