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This paper proposes a circular sequential lighting control method to reduce current imbalance and luminance deviation among multiple LED modules in AC-powered LED lighting systems. Conventional fixed-sequence lighting control repeatedly prioritizes the same LED modules in every rectified voltage cycle, which leads to unequal current distribution, luminance non-uniformity, and the accelerated degradation of specific modules during long-term operation. To address these limitations, a circular sequential lighting strategy is introduced, in which the lighting order is cyclically rotated at every rectified cycle, ensuring that all LED modules experience equal lighting opportunities. A prototype AC-LED lighting system consisting of four series-connected LED modules was implemented and experimentally evaluated. The results demonstrate that, while the conventional fixed-sequence method produces a maximum average current deviation of up to 1.6 mA among modules, the proposed method equalizes the average current across all modules to approximately 17.1 mA. Furthermore, the flicker index remains at 0.13, which is comparable to that of the conventional method, indicating that luminance uniformity is improved without degradation of optical performance. The proposed circular sequential lighting control effectively distributes electrical stress, enhances luminance uniformity, and improves long-term reliability, making it a practical and efficient solution for high-quality AC-LED lighting applications.
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Enhancement of SiO2 Uniformity by High-Pressure Deuterium Annealing
Yong-sik Kim, Dae-han Jung, Hyo-jun Park, Ju-won Yeon, Tae-hyun Kil, Jun-young Park
J Korean Inst Electr Electron Mater Eng 2024;37(2):148-153.   Published online March 1, 2024
DOI: https://doi.org/10.4313/JKEM.2024.37.2.4
As complementary metal-oxide semiconductor (CMOS) is scaled down to achieve higher chip density, thin-film layers have been deposited iteratively. The poor film uniformity resulting from deposition or chemical mechanical planarization (CMP) significantly affects chip yield. Therefore, the development of novel fabrication processes to enhance film uniformity is required. In this context, high-pressure deuterium annealing (HPDA) is proposed to reduce the surface roughness resulting from the CMP. The HPDA is carried out in a diluted deuterium atmosphere to achieve cost-effectiveness while maintaining high pressure. To confirm the effectiveness of HPDA, time-of-flight secondary-ion mass spectrometry (ToF-SIMS) and atomic force microscopy (AFM) are employed. It is confirmed that the absorbed deuterium gas facilitates the diffusion of silicon atoms, thereby reducing surface roughness.
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Power Prediction of P-Type Si Bifacial PV Module Using View Factor for the Application to Microgrid Network
Jin Ho Choi, David Kwangsoon Kim, Hae Lim Cha, Gyu Gwang Kim, Byeong Gwan Bhang, So Young Park, Hyung Keun Ahn
J Korean Inst Electr Electron Mater Eng 2018;31(3):182-187.   Published online March 1, 2018
DOI: https://doi.org/10.4313/JKEM.2018.31.3.182
In this study, 20.8% of a p-type Si bifacial solar cell was used to develop a photovoltaic (PV) module to obtain the maximum power under a limited installation area. The transparent back sheet material was replaced during fabrication with a white one, which is opaque in commercial products. This is very beneficial for the generation of more electricity, owing to the additional power generation via absorption of light from the rear side. A new model is suggested herein to predict the power of the bifacial PV module by considering the backside reflections from the roof and/or environment. This model considers not only the frontside reflection, but also the nonuniformity of the backside light sources. Theoretical predictions were compared to experimental data to prove the validity of this model, the error range for which ranged from 0.32% to 8.49%. Especially, under 700 W/m2, the error rate was as low as 2.25%. This work could provide theoretical and experimental bases for application to a distributed and microgrid network.
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The Conditions of a Holographic Homogenizer to Optimize the Intensity Uniformity
Chun Soo Go, Yong Ho Oh, Sung Woo Lim
J Korean Inst Electr Electron Mater Eng 2011;24(7):578-583.   Published online July 1, 2011
DOI: https://doi.org/10.4313/JKEM.2011.24.7.578
We report on the design of a holographic homogenizer composed of a periodic hologram and a condensing lens. If the hologram is periodic, the homogenizer is free from the alignment error of the incident laser beam. Holographic homogenizer also has an advantage of the flexibility in the size of the target beam. We calculated theoretically the Fraunhofer diffracted wave function when a rectangular laser beam is incident on a periodic hologram. The diffracted wave is the sum of sinc functions at regular distance. The width of each sinc function depends on the size of the incident laser beam and the distance between the sinc functions depends on the period of the hologram. We calculated numerically the diffracted light intensity for various ratios of the size of the incident laser beam to the period of the hologram. The results show that it is possible to make the diffracted beam uniform at a certain value of the ratio. The uniformity is high at the central part of the target area and low near the edge. The more sinc functions are included in the target area, the larger portion of the area becomes uniform and the higher is the uniformity at the central part. Therefore, we can make efficient homogenizer if we design a hologram so that the maximum number of the diffracted beams may be included in the target area.
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Semiconduclor : The Study on the Non-Uniformity of PECVD SiO2 Deposition by the Plasma Diagnostics
Young Hyun Ham, Kwang Ho Kwon, Hyun Woo Lee
J Korean Inst Electr Electron Mater Eng 2011;24(2):89-94.   Published online February 1, 2011
DOI: https://doi.org/10.4313/JKEM.2011.24.2.89
The cause of the thickness non-uniformity in the large area deposition of SiO2 films by PECVD(Plasma Enhanced Chemical Vapor Deposition) was investigated by the plasma diagnostics. The spatial distribution of the plasma species in the chamber was obtained with DLP(Double Langmuir Probe) and the new-designed probe-type QMS(Quadrupole Mass Spectrometer). From the relationship between the spatial distribution of the plasma species and the depositing rate of the SiO2 films, it was conformed that the non-uniform deposition of SiO2 films was related with the spatial distribution of the oxygen radical density and electron temperature.

Citations

Citations to this article as recorded by  
  • P‐11: Effects of Ar Dilution on N2O/SiH4 PECVD for the Growth of Silicon Oxide Thin Films with Improved Breakdown Voltage Characteristics
    Aram Kim, Bokyoung Lee, Hyeona Kim, Jungho Bang, Seung Hee Nam, Kwon-Shik Park, Jeomjae Kim, Soo Young Yoon
    SID Symposium Digest of Technical Papers.2022; 53(1): 1078.     CrossRef
  • In - situ diagnostics of PECVD AlO x deposition by optical emission spectroscopy
    Kyung Kim, Saul Winderbaum, Ziv Hameiri
    Surface and Coatings Technology.2017; 328: 204.     CrossRef
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Development of White LED Lamp Having High Color Uniformity With Transfer Molding Technology
Soon Jae Yu, Do Hyung Kim
J Korean Inst Electr Electron Mater Eng 2010;23(1):38-41.   Published online January 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.1.038

Citations

Citations to this article as recorded by  
  • Reflection Characteristics of Electroplated Deposits on LED Lead frame with Plating Condition
    SeHo Kee, Wonjoong Kim, JaePil Jung
    Journal of the Microelectronics and Packaging Society.2013; 20(2): 29.     CrossRef
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Properties of ZrO2 Gas Barrier Film using Facing Target Sputtering System with Low Temperature Deposition Process for Flexible Displays
Ji Hwan Kim, Do Hyun Cho, Sun Young Sohn, Hwa Min Kim, Jong Jae Kim
J Korean Inst Electr Electron Mater Eng 2009;22(5):425-430.   Published online May 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.5.425
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ITO Wet Etch Properties in an In-Line Wet Etch,Cleaning System by using an Alternating Movement of Substrate
Sung Jae Hong, Sang Jik Kwon, Eou Sik Cho
J Korean Inst Electr Electron Mater Eng 2008;21(8):715-718.   Published online August 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.8.715
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Effect of Temperature on Polishing Properties in Oxide CMP
Young Jin Kim, Boum Young Park, Hyoung Jae Kim, Hae Do Jeong
J Korean Inst Electr Electron Mater Eng 2008;21(2):93-98.   Published online February 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.2.093
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Mechanical Analysis on Uniformity in Copper Chemical Mechanical Planarization
J Korean Inst Electr Electron Mater Eng 2007;20(1):74-79.   Published online January 1, 2007
DOI: https://doi.org/10.4313/JKEM.2007.20.1.074
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Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP
J Korean Inst Electr Electron Mater Eng 2006;19(4):309-313.   Published online April 1, 2006
DOI: https://doi.org/10.4313/JKEM.2006.19.4.309
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A Study on the Within Wafer Non-uniformity of Oxide Film in CMP
J Korean Inst Electr Electron Mater Eng 2005;18(6):521-526.   Published online June 1, 2005
DOI: https://doi.org/10.4313/JKEM.2005.18.6.521
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A Study on DOE Method to Optimize the Process Parameters for Cu CMP
J Korean Inst Electr Electron Mater Eng 2005;18(1):24-29.   Published online January 1, 2005
DOI: https://doi.org/10.4313/JKEM.2005.18.1.024

Citations

Citations to this article as recorded by  
  • Statistical Analysis on Process Variables in Linear Roll-CMP
    Han Wang, Hyunseop Lee, Haedo Jeong
    Journal of the Korean Society of Tribologists and Lubrication Engineers.2014; 30(3): 139.     CrossRef
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  • 1 Crossref
Planarization Characteristics of CMP for WO3 Film with an Addition of Oxidizers
J Korean Inst Electr Electron Mater Eng 2005;18(1):12-16.   Published online January 1, 2005
DOI: https://doi.org/10.4313/JKEM.2005.18.1.012
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A Study on CMP Properties of SnO2 Thin Film for Application of Gas Sensor
J Korean Inst Electr Electron Mater Eng 2004;17(12):1296-1300.   Published online December 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.12.1296
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Characteristics of Friction Affecting CMP Results
J Korean Inst Electr Electron Mater Eng 2004;17(10):1041-1048.   Published online October 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.10.1041

Citations

Citations to this article as recorded by  
  • Material Removal Mechanism of CMP Pad by CVD Conditioner Cutting Edges
    Jiho Shin, Jongmin Jeong, Yeongil Shin, Haedo Jeong
    Journal of the Korean Society for Precision Engineering.2026; 43(7): 671.     CrossRef
  • Effect of pad’s surface deformation and oscillation on monocrystalline silicon wafer surface quality
    Woong-Kirl Choi, Seong-Hyun Kim, Seung-Geon Choi, Eun-Sang Lee, Chul-Hee Lee
    International Journal of Precision Engineering and Manufacturing.2014; 15(11): 2301.     CrossRef
  • Evaluation of the wafer polishing pad capacity and lifetime in the machining of reliable elevations
    Eun-Sang Lee, Ji-Wan Cha, Seong-Hyun Kim
    International Journal of Machine Tools and Manufacture.2013; 66: 82.     CrossRef
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Effects of Oxidizer Additive on the Performance of Copper-Chemical Mechanical Polishing using Tungsten Slurry
U Seon Lee, Gwon U Choe, Yeong Sig Lee, Yeon Og Choe, Yong Taeg O, Yong Jin Seo
J Korean Inst Electr Electron Mater Eng 2004;17(2):156-161.   Published online February 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.2.156
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Aging Effects of Silica Slurry and Oxide CMP Characteristics
U Seon Lee, Pil Ju Go, Yeong Sig Lee, Yong Jin Seo, Gwang Jun Hong
J Korean Inst Electr Electron Mater Eng 2004;17(2):138-143.   Published online February 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.2.138
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Superconductor : Fabrication of YBCO Superconducting Thick Film by Use of Lateral Shaky Field Assisted EPD Method
Dae Hwa So, Yong U Jeon
J Korean Inst Electr Electron Mater Eng 2003;16(11):1041-1046.   Published online November 1, 2003
DOI: https://doi.org/10.4313/JKEM.2003.16.11.1041
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Effects of Mixed Oxidizer on the W-CMP Characteristics
Chang Jun Park, Yong Jin Seo, Sang Yong Kim, U Seon Lee
J Korean Inst Electr Electron Mater Eng 2003;16(12s):1181-1186.
DOI: https://doi.org/10.4313/JKEM.2003.16.12s.1181
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